GM3207B

Ultra-precision end-face nanometer grinding machine

GM3207B 超精密研磨机

Ultra-Precision Machining Equipment

Ultra-precision end-face nanometer grinding machine

Model:GM3207B

Product Overview

端面纳米级研磨设备,用于高精度平面研磨抛光。适用于光学元件、半导体晶圆的超精密研磨,实现纳米级表面质量。

Application Areas

  • 光学元件研磨
  • 半导体晶圆
  • 精密陶瓷
  • 平面研磨
  • 抛光加工

技术参数

表面粗糙度Ra < 2nm
平面度< 0.1μm
加工直径320mm
加工方式端面研磨

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