GM3207B (Diamond)
Ultra-precision end-face nanometer grinding machine
Ultra-Precision Machining Equipment
Ultra-precision end-face nanometer grinding machine
Model:GM3207B (Diamond)
Product Overview
纳米级端面研磨设备，适用于光学元件、半导体晶圆的超精密研磨。
Application Areas
- 光学元件研磨
- 半导体晶圆
- 精密陶瓷
技术参数
| 表面粗糙度 | Ra < 2nm |
| 平面度 | < 0.1μm |
| 加工直径 | 320mm |
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